JPH01103273U - - Google Patents
Info
- Publication number
- JPH01103273U JPH01103273U JP1987200671U JP20067187U JPH01103273U JP H01103273 U JPH01103273 U JP H01103273U JP 1987200671 U JP1987200671 U JP 1987200671U JP 20067187 U JP20067187 U JP 20067187U JP H01103273 U JPH01103273 U JP H01103273U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- soldered
- solder
- view
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000006071 cream Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987200671U JPH0749732Y2 (ja) | 1987-12-28 | 1987-12-28 | 半田付け実装部品のリ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987200671U JPH0749732Y2 (ja) | 1987-12-28 | 1987-12-28 | 半田付け実装部品のリ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01103273U true JPH01103273U (en]) | 1989-07-12 |
| JPH0749732Y2 JPH0749732Y2 (ja) | 1995-11-13 |
Family
ID=31491067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987200671U Expired - Lifetime JPH0749732Y2 (ja) | 1987-12-28 | 1987-12-28 | 半田付け実装部品のリ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749732Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0491071U (en]) * | 1990-12-25 | 1992-08-07 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12199194B2 (en) | 2019-11-28 | 2025-01-14 | Kyocera Corporation | Wiring base, package for storing semiconductor element, and semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125373U (ja) * | 1982-02-18 | 1983-08-25 | 富士通株式会社 | プリント配線板 |
| JPS5947747A (ja) * | 1982-09-10 | 1984-03-17 | Hitachi Ltd | 半導体装置 |
-
1987
- 1987-12-28 JP JP1987200671U patent/JPH0749732Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125373U (ja) * | 1982-02-18 | 1983-08-25 | 富士通株式会社 | プリント配線板 |
| JPS5947747A (ja) * | 1982-09-10 | 1984-03-17 | Hitachi Ltd | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0491071U (en]) * | 1990-12-25 | 1992-08-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0749732Y2 (ja) | 1995-11-13 |